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Fig. 2 | Journal of Orthopaedic Surgery and Research

Fig. 2

From: Bioelectronic osteosynthesis plate to monitor the fracture bone healing using electric capacitive variations

Fig. 2

Overall monitoring system including the bioelectronic osteosynthesis plate, and computational analysis using smartphone and computer systems. Illustration of PCB boards: a) PCB modular structure comprising: 1: RN4871 Bluetooth Module; 2: PIC16LF1847; 3: ADG1606 Multiplexer; 4: AD7745 Analog-to-Digital Converter; 5: 16-Pin Connector; 6: CR1216 Miniaturized Battery; b) PCB matrix-structured network of interdigitated and striped capacitive systems

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